editedbook
Publication: IIP Proceedings Year: 2022, Month: November Page No: 249-268, ISSN/ISBN: 978-81-959356-1-1, DOI/Link: https://rsquarel.org/assets/docupload/rsl20235347EDCBA492F89.pdf
INTEGRATED CIRCUITS FABRICATION TECHNIQUES FOR C-MOS, N-MOS AND BJT
Area/Stream: Network & Communication Technologies, Authors: Shivam Bhardwaj,Shivam,Jay Varshney,Inderpreet Kaur,Hari Kumar Singh Keywords: VLSI Technology, CMOS IC Fabrication, NMOS IC Fabrication, BJT IC Fabrication, Fabrication, Etching, Diffusion Metallization Book Name /series: Futuristic Trends in Network & Communication Technologies,Volume 2, Book 19, Part 3, Chapter 4Publication: IIP Proceedings Year: 2022, Month: November Page No: 249-268, ISSN/ISBN: 978-81-959356-1-1, DOI/Link: https://rsquarel.org/assets/docupload/rsl20235347EDCBA492F89.pdf
Abstract:
Integrated Circuit designs will be realised in one of a number of possible fabrication processes. The circuit fabricated on a die will then be packaged within a suitable protective housing. The particular fabrication process to use will be dependent on a number of issues including cost, availability, experience in the use of, and circuit component capabilities. Complex processes and technology utilizing minute dimensions are essential to the fabrication of today’s high density integrated circuits. The key unit processes for circuit fabrication outlined within this paper are chemical vapor deposition, oxidation, diffusion and ion implantation, metallization and lithography. The parallel advances of these processes have led to a new era of very large scale integrated (VLSI) circuits with low micrometer to submicron features that result in denser, faster and more complex devices. The most critical advances, however, have been in the areas of lithography and etching, where electron-beam systems, along with plasmaassisted etching techniques, have enabled further miniaturization. New materials have been developed, including the low resistivity silicdes. Packaging advances also translate into major production cost savings. Finally, the interaction of computer aided design, process simulation, production/process control, in-process measurement, characterization and final testing play a critical role in VLSI fabrication technology.
Cite this: Shivam Bhardwaj,Shivam,Jay Varshney,Inderpreet Kaur,Hari Kumar Singh ,"INTEGRATED CIRCUITS FABRICATION TECHNIQUES FOR C-MOS, N-MOS AND BJT", Futuristic Trends in Network & Communication Technologies,Volume 2, Book 19, Part 3, Chapter 4, November, 2022, 249-268, 978-81-959356-1-1, https://rsquarel.org/assets/docupload/rsl20235347EDCBA492F89.pdf
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